Detection apparatus and method for detection of chi energy

ABSTRACT

Detection arrangement and method for detection of chi energy using TADF material as well as use of a detection arrangement for detection of chi energy.

FIELD OF THE INVENTION

The present invention relates, generally, to the field of detection ofenergy flows, more particularly, to TADF (thermally activated delayedfluorescence) material based detection of chi energy.

BACKGROUND OF THE INVENTION

The ancient culture of Feng Shui is currently widely spread around theworld. There exist complex and alternating configurations of flows ofenergy called chi energy. There are various sources and types of chienergy, such as chi energy coming from space, terrestrial sources, humansources or other types of chi energy. Many factors affect the flow ofchi energy on Earth, such as landscapes, water flows and roadnetworks/infrastructures, specific geological peculiarities, buildings,vegetation etc. Depending on the parameters of the flow of chi energy ata given place and time, the energy may have favorable, neutral oradverse effects on human health or other living organisms.

Nowadays, there are several schools of Feng Shui, differing by their wayof determining the properties of flows of chi energy. All of them usingindirect methods for the detection of chi energy.

The concept of chi energy or chi energy fluxes is widely used, forexample in medicine, civil architecture and/or landscape design.However, a detection method of chi energy or chi energy fluxes, chienergy of low and very low energy as well as chi energy of low and verylow intensity still does not exist.

OBJECTION OF THE INVENTION

An object of the present invention is to provide a solution for thedetection or measurement of chi energy and/or fluxes of chi energy.

SUMMARY OF THE INVENTION

To solve the above object, the present invention provides subject-matteraccording to the accompanying independent claims, wherein variations,embodiments and examples thereof are defined in accompanying dependentclaims.

More particularly, the present invention provides a detectionarrangement for detection of chi energy, the arrangement comprising:

-   -   a detection layer comprising thermally activated delayed        fluorescence TADF material, the thermally activated delayed        fluorescence TADF material having an excitation frequency range        and, exhibiting upon excitation with radiation in the excitation        frequency range, a thermally activated delayed fluorescence TADF        emission, wherein    -   the TADF material having a TADF emission pattern without        exposure to chi energy and exhibiting a different TADF emission        pattern with exposure to chi energy.

The detection arrangement may further comprise:

-   -   a computing device,    -   an excitation radiation source device adapted to emit excitation        radiation in the excitation frequency range,    -   a radiation detector device communicatively coupled with the        computing device, the radiation detector device being adapted to        detect TADF emission from the detection layer and provide        respective detection data to the computing device.    -   wherein the computing device is being adapted to:        -   compute detection data from the radiation detector device to            determine a TADF emission pattern without exposure to chi            energy and a different TADF emission pattern with exposure            to chi energy,        -   compare the determined TADF emission patterns,        -   determine, on the basis of the comparison, exposure to chi            energy onto the detection layer.

TADF (thermally activated delayed fluorescence) material based detectionhas an extremely low energy level or energy threshold.

The detection layer may be at least one of

-   -   ,    -   provided in a coating material,    -   shaped as a part of a sphere,    -   shaped as a hollow or solid sphere,    -   shaped as a polyhedron.

The radiation detector device may comprise at least one of

-   -   a discrete radiation detector,    -   a radiation detector array including at least two detector        elements,    -   electro-optical transducer,    -   image intensifier tube,    -   vacuum tube,    -   CMOS chip    -   a CCD chip.

The detection arrangement may comprise at least two radiation detectordevices, wherein the detection layer is arranged between the at leasttwo radiation detector devices.

The radiation detection arrangement may comprise a control device forcontrolling the operation of the excitation radiation source device,wherein the control devices is adapted to operate the excitationradiation source device in a constant emission mode and/or avariable/modifiable emission mode, comprising pulsed and/or periodicalemission mode.

The computing device may be able to compute detection data from theradiation detector device during and/or following radiation emissionfrom the excitation radiation source device.

The detection arrangement may comprise an optical system being arrangedbetween the detection layer and the radiation detector device.

The detection arrangement may comprise a housing accommodating thecomponents of the detection arrangement.

The housing may have shielding properties for shielding of at least oneof:

-   -   electro-magnetic radiation;    -   X-ray radiation;    -   ultraviolet radiation;    -   Gamma radiation;    -   corpuscular radiation, comprising alpha radiation, beta        radiation, neutrons and/or protons.

The detection arrangement may comprise at least one temperature sensingdevice for sensing temperature of at least one of

-   -   the detection layer,    -   the TADF material,    -   the excitation radiation source device,    -   the radiation detector device,    -   the housing,    -   the optical system,    -   the computing device.

The detection arrangement or one or more parts thereof (particularly,the parts listed above) may be placed in a temperature-controlledenvironment.

For example, it is envisaged to use a passive temperature-controlledenvironment, where the detection arrangement or one or more partsthereof may be arranged in a box, container, housing and the like havingthermal characteristics (e.g. walls with high thermal resistance) thatmaintain a temperature in its interior at least for some period of time.Examples for a passive temperature-controlled environment include aDewar flask/container.

Further, it is also envisaged to use an active temperature-controlledenvironment, where the detection arrangement or one or more partsthereof may be arranged in a box, container, housing and the like forwhich the inner temperature may be actively controlled by using heatingand/or cooling of the interior and at least one temperature sensor fortemperature control.

Also, combinations of active and passive temperature-controlledenvironments may be used, wherein, for example, some parts of thedetection arrangement may be in an active temperature-controlledenvironment and other parts of the detection arrangement are in apassive temperature-controlled environment.

Further, the present invention provides a method of detecting chi energyusing a detection arrangement, wherein the method comprises the stepsof:

-   -   providing a detection layer comprising thermally activated        delayed fluorescence TADF material, the thermally activated        delayed fluorescence TADF material having an excitation        frequency range and, exhibiting upon excitation with radiation        in the excitation frequency range, a thermally activated delayed        fluorescence TADF emission,    -   detecting TADF emission from the detection layer by means of a        radiation detector device, wherein        -   the TADF material having a TADF emission pattern without            exposure to chi energy and exhibiting a different TADF            emission pattern with exposure to chi energy.

The method may further comprise the steps of:

-   -   emitting excitation radiation in the excitation frequency range        by means of an excitation radiation source device onto the        detection layer in order to excite the TADF material, wherein    -   the radiation detector device is communicatively coupled to a        computing device for the detection of TADF emission from the        detection layer;        -   providing detection data from the radiation detector device            to the computing device,        -   computing the detection data from the radiation detector            device to determine a TADF emission pattern without exposure            to chi energy and a different TADF emission pattern with            exposure to chi energy,        -   comparing the determined TADF emission patterns,        -   determining, on the basis of the comparison, exposure to chi            energy onto the detection layer.

The method may further comprise the steps of:

-   -   controlling the operation of the excitation radiation source        device by means of a control device and    -   emitting radiation, by operating the excitation radiation source        device, in a constant emission mode and/or a variable/modifiable        emission mode, comprising pulsed and/or periodical emission        mode; and/or    -   arranging an optical system between the detection layer and the        radiation detector device for adjusting the TADF emission onto        the radiation detector device; and/or    -   at least one of:        -   thermally calibrating the radiation detection arrangement            for compensation of temperature related effects on the            radiation detection device,        -   arrangement calibrating the radiation detection device as            such for compensation of at least background radiation to            which the radiation detection device is exposed.

According to the method of the present invention, in an excitationphase, phase excitation radiation may be emitted onto the detectionlayer in order to excite the TADF material and, in a detection phasesubsequent to the excitation phase, TADF emission from the detectionlayer may be detected.

In some examples, the excitation phase and the detection phase may, atleast partially, overlap. For example:

-   -   the excitation phase and the detection phase may start at the        same time and may take place for the same period of time;    -   the excitation phase and the detection phase may start at the        same time, wherein the excitation phase ends, while the        detection is phase is still ongoing and is continued for some        further period of time;    -   the detection phase takes place for a period of time, during        which at least two excitation phases take place one after        another with a pause therebetween (i.e. period of time without        excitation), wherein the at least excitation phases may have the        same duration or different durations;    -   the excitation phase may start and, at some point of time when        the excitation phase takes place, the detection phase may also        start, wherein the excitation phase may end earlier or at the        same time, or later than the detection phase.

In further examples, there may a transition phase between the excitationphase and the detection phase, during which transition phase neitherexcitation nor detection takes place.

The method may further comprise the steps of:

-   -   providing a housing, having shielding properties to shield at        least one of:    -   electro-magnetic radiation,    -   X-ray radiation,    -   Ultraviolet radiation,    -   Gamma radiation,    -   Corpuscular radiation,    -   alpha radiation,    -   beta radiation,    -   neutrons    -   protons.

Furthermore, the detection arrangement of the present invention is usedfor the detection of chi energy.

SUMMARY OF THE DRAWINGS

In the description of embodiment further below, it is referred to thefollowing drawings, which show:

FIG. 1 a schematic illustration of a detection arrangement for detectionof external radiation and/or chi energy,

FIG. 2 a schematic illustration of a further detection arrangement fordetection of chi energy,

FIG. 3 a schematic illustration of a yet further detection arrangementfor detection of chi energy,

FIG. 4 a schematic illustration of detection arrangement's emissionpatterns with and without chi energy,

FIGS. 5a and 5b schematic illustrations for explanation of emissiondistributions with and without chi energy,

DESCRIPTION OF EMBODIMENTS

Generally, features and functions referred to with respect to specificdrawings and embodiments may also apply to other drawings andembodiments, unless explicitly noted otherwise.

Known conventional components, which are necessary for operation, (e.g.energy supply, cables, controlling devices, processing devices, storagedevices, etc.), are neither shown nor described, but are neverthelessconsidered to be disclosed for the skilled person.

FIG. 1 schematically illustrates a detection arrangement 2 for detectionof external radiation and/or chi energy having low intensity and/orenergy. External radiation 4 refers to radiation impinging onto theradiation detection arrangement 2 and/or the radiation detectionarrangement 2 is exposed to.

In the drawings, just a radiation beam along a direction (like from asingle source) is illustrated. However, this is just for simplification.Rather, external radiation 4 may include more than one radiation beam,namely a plurality thereof, and/or radiation fronts. Also, externalradiation 4 may impinge from more than a direction, e.g. a plurality ofdifferent directions, even opposing ones.

The detection arrangement 2 comprises a housing 6. The housing 6 acts asshield against external radiation 6 that shall not be detected by thedetection arrangement 2. Such radiation is referred to as shieldableradiation 8. Examples for shieldable radiation 8 include one or more ofthe following: visible light, neutrons, electrons, protons, myons,cosmic radiation, electro-magnetic radiation, X-ray radiation,ultraviolet radiation, Gamma radiation, corpuscular radiation, alpharadiation, beta radiation, thermal radiation, thermal disturbances.

Shieldable radiation 8 is blocked by the housing 6 so that no part ofshieldable radiation 8 can enter the space defined the housing 6. Thisis illustrated in the drawings by arrows 8 indicting reflectedshieldable radiation. However, shielding effected by the housing 6 maybe (additionally or alternatively) provided by absorption or any otherway ensuring that no shieldable radiation reaches the inner of thehousing.

Contrary thereto, the housing 6 does not block, shield off or prohibitin any other way external radiation that may be measured. Such radiationis referred to as measurable radiation 10. Examples for measurableradiation 10 may include one or more of the following: neutrinos,neutralinos, WIMPS (Weakly interacting massive particles), highpenetrating cosmic rays and particles, high penetrating radiation fromnuclear reactors and nuclear sets or any other particle(s), rays orradiation chi energy is composed of.

According to such a configuration, the detection arrangement 2 is ableto detect external radiation of low energy and/or intensity that is e.g.due to solar events like solar flares, or cosmic events of differentnature.

However, in case of the absence of such events and/or the effects ofsuch events on the detection arrangement are compensated, the detectionarrangement 2 may be used to detect or measure the (natural) radiationor radiation flows/fluxes on the Earth's surface or also radiationflows/fluxes of the nearby space.

In particular, the detection arrangement 2 may be placed at the point orregion of interest, e.g. on the ground. Additionally, the detectionarrangement 2 may be equipped with an (optional) EM shielding. Theradiation level on the point of interest, e.g. in the absence of cosmicevents, may be compensated, for example by subtracting the longtime meanvalue or reference data.

To this end, the detection arrangement 2 may be placed on the ground andradiation will be detected or collected for a certain time period.Afterwards, either a longtime mean value, e.g. calculated by a series ofdifferent measurements is to be subtracted, or, reference data, e.g.collected from other measurements or common to a particular region, maybe subtracted.

Additionally, a possible signal related to a cosmic event may also becompensated, i.e. if required. To do so, a second (stationary) detectionarrangement 2 may be located nearby the detection arrangement 2 in thepoint or region of interest. The data of the second detectionarrangement 2 may be used to compensate a signal of a cosmic event.Also, a detection network, comprised of more than 1 additional detectionarrangement 2 may be used for such a compensation.

Chi energy, or flows, beams or fluxes of chi energy exhibitsingularities e.g. near to natural or artificial water streams, e.g. atspecific or characteristic points in landscape, e.g. in areas of activeorogeny (e.g. mountain formation) and e.g. at industrial landscapes suchas peaks, hills, buildings or the like. Numerous empirical datasets showa correlation between such environmental conditions and/or landscapeand/or flora and/or fauna conditions or an influence thereof. Suchinfluence is considered to be rather weak (i.e. of low or very lowenergy and/or intensity), because otherwise it could/would be found inother experiments, e.g. at time scales of landscape and biocenosisformation.

However, as discussed further above, the detection arrangement 2 is ableto detect external radiation having low intensity and/or energy. Assuch, by compensating the effect of cosmic events and/or the naturalradiation value (e.g. background) a measurement of (other) low energeticflows, fluxes, beams becomes possible that can eventually be related tochi energy.

As such, the detection arrangement 2 according to FIG. 1, is able tomeasure chi energy, chi energy beams/flows/fluxes having low intensityand/or low energy. Chi energy 4 refers to radiation impinging onto thedetection arrangement 2 and/or the detection arrangement 2 is exposedto. Further, it should be noted that chi energy, chi energy fluxes, chienergy beams and/or chi energy fronts may be detected by the detectionarrangement 2.

As set forth, when the detection arrangement 2 is placed at a point orregion of interest and in the absence of flows of chi energy, i.e.without chi energy impinging on the detection arrangement 2, the outputof the detection arrangement 2 will merely show fluctuations around thebackground radiation value. During this time, the detection arrangement2 may be kept stationary.

Contrary thereto, i.e. when the detection arrangement 2 is moved, ande.g. placed in a chi energy stream/beam/flux, for example by moving thedetection arrangement 2 along natural/environmental conditions orpeculiarities, a signal proportional to the power of the chi energystream/beam/flux can be observed, measured or detected at the output ofthe detection arrangement 2.

As the detection arrangement 2 moves (e.g. along natural water networksand/or for example in areas of active orogeny, e.g. mountain formation)the detection arrangement 2 detects and shows output patterns andradiation streams along and repeating the peculiarities of their energyflow indicating the measurement of chi energy or flows/fluxes/beams ofchi energy.

Starting therefrom, FIG. 1 further schematically illustrates a detectionarrangement 2 for detection of chi energy 4 having low intensity and/orenergy. Chi energy 4 refers to radiation impinging onto the radiationdetection arrangement 2 and/or the radiation detection arrangement 2 isexposed to. The shielding and measuring properties for detection of chienergy may be the identical to the shielding and measuring propertiesfor the detection of external radiation, but may also be different.

In the drawings, just a chi energy beam along one direction (like from asingle source) is illustrated. However, this is just for simplification.Rather, chi energy 4 may include more than one beam or stream, namely aplurality thereof, and/or radiation fronts. Also, chi energy 4 mayimpinge from more than one direction, e.g. a plurality of differentdirections even opposing ones.

With respect to chi energy measurement, shieldable radiation 8 isblocked by the housing 6 so that no part of shieldable radiation 8 canenter the space defined the housing 6. This is illustrated in thedrawings by arrows 8 indicting reflected shieldable radiation. However,shielding effected by the housing 6 may be (additionally oralternatively) provided by absorption or any other way ensuring that noshieldable radiation reaches the inner of the housing.

Contrary thereto, the housing 6 does not block, shield off or prohibitin any other way chi energy that may be measured. Accordingly, chienergy is referred to as measurable radiation 10.

When reference is made to chi energy, chi energy fluxes, flows, beamsand streams having low intensity and/or energy are also comprisedtherein.

The housing 6 may be adapted to act as at least one of the following:

-   -   optically non-transparent shield,    -   thermal shield,    -   electromagnetic shield,    -   shield against at least one of UV radiation, gamma radiation,        corpuscular radiation, X-rays, alpha radiation, beta radiation.

The material of the housing 6 may comprise, for example, at least one ofthe following:

-   -   metal (e.g. for optically non-transparent shielding),    -   plastic (e.g. for optically non-transparent shielding),    -   gas gap and/or low thermal conductivity polymers (e.g. for        thermal shielding),    -   multi layered construction including layers of different        material, for example alternating layers of material having low        and high thermal conductivity, like copper foil, (e.g. for        thermal shielding),    -   low thermal conductivity material, like polymer, (e.g. for        thermal shielding),    -   closed (e.g. complete and/or hermetic) grounded metal coating        (e.g. Al, Cu) (e.g. for electromagnetic shielding)

UV/gamma/corpuscular/X-rays/alpha/beta shield:

-   -   Aluminum (e.g. for shielding of at least one of UV radiation,        gamma radiation, corpuscular radiation, X-rays, alpha radiation,        beta radiation),    -   glass (e.g. for shielding of at least one of UV radiation, gamma        radiation, corpuscular radiation, X-rays, alpha radiation, beta        radiation),    -   textolite (e.g. for shielding of at least one of UV radiation,        gamma radiation, corpuscular radiation, X-rays, alpha radiation,        beta radiation),    -   concrete (e.g. for shielding of at least one of UV radiation,        gamma radiation, corpuscular radiation, X-rays, alpha radiation,        beta radiation).

An exemplary housing may have walls comprising an Aluminum sheet/layerwith a thickness of at least about 10 mm; one, two or three glass layerseach having a thickness of at least about 2 mm; a textolite layer with athickness of about 1 mm with an optional cooper foil at least at oneside of the textolite layer.

The distance between the inner surface of the housing 6 and thedetection layer 12 may be 0 mm (i.e. no distance) or, for example, inthe range of at least about 30 mm.

Further shielding can be achieved by providing a housing that—inaddition to at least one of the above mentioned examples or as optionthereto—is made of concrete and completely surrounds the detectionarrangement. This can be accomplished by, for example, positioning thedetection arrangement in a hollow concrete cube having 6 concrete wallswith a thickness of, e.g., about 3 meters and more.

Inside the housing 6, the detection arrangement 2 comprises a detectionlayer 12, which comprises at least a TADF material, i.e. materialexhibiting thermally activated delayed fluorescence. The TADF materialof the detection layer 12 has an excitation frequency range, where theTADF material, if being excited by radiation in the excitation frequencyrange, exhibits a thermally activated delayed fluorescence.

Also inside the housing 6, the detection arrangement comprises aexcitation radiation source 14 and a radiation detector device 16.

The excitation radiation source device 14 is capable of providingradiation (at least) in the excitation frequency range of the TADFmaterial. Such radiation is referred to as excitation radiation 18. Theexcitation radiation source device 14 can be controlled to providecontinuous excitation radiation 18, i.e. to be operated in a constantemission mode. The excitation radiation source device 14 can becontrolled to provide non-continuous excitation radiation 18, i.e. to beoperated in a variable emission mode, to provide, for example, pulsedand/or periodical excitation radiation.

The excitation radiation source device 18 can comprise one or moreexcitation radiation sources, for example, one or more LEDs. Thedrawings show a single excitation radiation source device 18. However,two and more excitation radiation source devices arranged adjacent toeach other or spaced from each other can be employed.

The radiation detector device 16 is capable of detecting (at least)radiation provided by the detection layer 12, particularly thermallyactivated delayed fluorescence from the TADF material in response toexcitation by excitation radiation from the excitation radiation sourcedevice 18.

The radiation detector device 16 can comprise one or more radiationdetectors, for example photo detectors being sensitive to a leastfluorescence that the TADF material can emit.

As illustrated in FIGS. 1 and 3, one radiation detector device 16 can beemployed, while FIG. 2 illustrates an embodiment employing two radiationdetector devices 16. However, more than two radiation detector devices16 can be used, in order to, for example, detect radiation from thedetection layer at different locations in the housing 6.

The radiation detector device 16 can have a planar detection surface 20,as illustrated in the drawing. However, radiation detector deviceshaving a, for example, curved detection surface as indicated by thedashed curved detection surface 22 in FIG. 1.

The size and form of the detection surface can be designed such that itconforms the size and form of a detection layer's emission surface 24from where detection layer radiation and, particularly, TADFfluorescence can be emitted. This allows capturing and detecting as muchradiation from the detection layer as possible.

According to the illustrations of FIGS. 1 and 3, the detection layer 12has a single emission surface 24, while the detection layer 12 of FIG. 2has two emission surfaces 24.

The radiation detector device 16 is capable of outputting detection dataindicating radiation detected by the radiation detector device 16.

In addition or as alternative, an optical system can be arranged betweenthe detection layer 12 and a radiation detector device 16, as explainedfurther below with reference to FIG. 3.

The radiation detection arrangement 2 further includes computing device26. The computing device 26 is communicatively coupled with theradiation detector device 16 to, at least, obtain detection dataoutputted from the radiation detector device 16. Further, the computingdevice 26 may be arranged to control the radiation detector device 16and its operation, respectively.

The computing device 26 may be also communicatively coupled with theexcitation radiation source device 14 to control the operation thereof.

A communicative coupling between the computing device 26 and anotherpart of the radiation detection arrangement (e.g. the radiationdetection device 16 and excitation radiation source device 14) may bewired and/or wireless.

The computing device 26 is adapted, e.g. in the form of respectivelydesigned hardware and/or software, to compute detection data from theradiation detector device 26 in a manner to determine one or moreemission patterns resulting from radiation emitted by the detectionlayer and, particularly, from thermally activated delayed fluorescencefrom the TADF material.

If applicable, the computing device 26 may control the operation of theexcitation radiation source device 14. For example, the excitationradiation source device 14 may be controlled such that it emitsexcitation radiation 18 synchronized with detection operation of theradiation detector device 16. In some examples, the following proceduremay be used: The excitation radiation source device 14 may be operatedto emit excitation radiation for a predefined first period of time (e.g.a phase of 1 ms).

Then, during a second predefined period of time (e.g. a phase of 1 ms)no excitation radiation is emitted and the radiation detector device 16is not activated/operated to detect radiation from the detection layer12 and, particularly thermally activated delayed fluorescence from theTADF material. This period of time and phase, respectively, allowstransition processes to take place in, e.g., the TADF material and/orthe hardware components of the arrangement.

After that, during a third predefined period of time (e.g. a phase of 3ms) the radiation detector device 16 is activated/operated to detectradiation from the detection layer 12 and, particularly thermallyactivated delayed fluorescence from the TADF material.

This procedure can be referred to as radiation detection based onpre-excited TADF material, because in a first phase (also referred to aexcitation phase) TADF material is excited by excitation radiation andin a second phase (also referred to a detection phase) TADF emission isdetected/sensed on the basis of which measurable radiation can bedetected. Preferably, as indicated above, there is an intermediate phase(also referred to as transition phase) between the excitation phase andthe detection phase

In other examples, the excitation radiation source device 14 may beoperated to emit excitation radiation as pulses of the same or differentlevel and/or with predefined time intervals of the same or varyinglength in between. Also, the excitation radiation source device 14 maybe operated to emit constant excitation radiation (without periodswithout excitation radiation) of the same level or of at least twodifferent levels (e.g. like a waveform or stepwise).

Generally, any type of one or more TADF material and combinationsthereof may employed. An exemplary TADF material used in experimentsincluded an organic luminofor comprising a mixture of fluoresceinNatrium and boric acid.

A possible mass ration of the components can be in the range of1:100,000-1:500.

The components can be mixed and heated to manufacture the exemplary TADFmaterial, for example according to a specific heating profile. The mixedmaterials are for example heated up to a maximal temperature in therange between 200° C. and 260° C. for at least 20 minutes under apressure below 0.8 bar.

The heating may be performed in pre-molded forms to obtain TAFD materialhaving a predefined shape. Also, after heating the material can begrounded and mixed with a carrier material (e.g. epoxy), after which theresulting material can be formed to get any desired shape (e.g. byapplying onto a support surface).

In the detection device of FIG. 1, the TADF material of the detectionlayer 12 is excited by excitation radiation 18 from the excitationradiation source device 14, and in response thereto, emits thermallyactivated delayed fluorescence 28. The emitted thermally activateddelayed fluorescence 28 impinges onto the radiation detector device 16,which generates respective detection data. The detection data generatedby the radiation detector device 16 are computed by the computing device26 to determine one or more emission patterns resulting from thermallyactivated delayed fluorescence from the TADF material.

In general, this is also the case with the radiation detection devicesof FIGS. 2 and 3.

However, in the detection device of FIG. 2, two radiation detectordevices 16 are used to detect thermally activated delayed fluorescence28 emitted by the TADF material of the detection layer 12. The detectiondata respectively generated by the radiation detector devices 16 arecomputed by the computing device 26 to determine one or more emissionpatterns resulting from thermally activated delayed fluorescence fromthe TADF material. Since detection data from two radiation detectordevices 16 are available, the detection data from the differentradiation detector devices 16 can be used to compare the one or moreemission patterns on one of radiation detector devices 16 with the oneor more emission patterns of the other radiation detector device 16.

For example, two and more radiation detector devices 16 can be used fora correlated detection of measurable radiation 10, wherein, e.g., onlysynchronized detection data from different radiation detector devices16. Synchronization may include to operate the radiation detectiondevices 16 such that their respective detection data are provided at thesame time or processed such that detection data generated at the sametime and/or in the same time period are processed together. In additionor as alternative, synchronization may include to use together detectiondata being generated at/in corresponding areas of the respectivedetection surfaces of the radiation detection devices 16. In addition oras alternative, synchronization may include using detection data beingindicative of TADF emission coming from different parts/surfaces of thedetection layer 12 and TADF material, respectively, in order to, forexample, detect TADF emission from opposing detection layer's surfacesas illustrated in FIG. 2.

As further example, two and more radiation detector devices 16 can beused to distinguish different types of measurable radiation 10, wherein,e.g., differences between detection data from different radiationdetector devices 16 are calculated. More detailed observations in thisrespect can be find further below with reference to FIGS. 5a and 5.

In the radiation detection device of FIG. 3, an optical system 30 isused to collect and/or focus thermally activated delayed fluorescencefrom the TADF material onto the radiation detector device 16, in orderto, for example, avoid “loosing” such radiation from being captured bythe radiation detector device.

In any case, the pattern in which thermally activated delayedfluorescence is emitted from the TADF material depends on chi energyreaching the TADF material. As illustrated in FIG. 4, without chi energyreaching the detection layer 12 (i.e. without measurable radiation 10),the TADF material exhibits a more or less homogenous emission pattern32. If chi energy reaches the detection layer 12 (i.e. case withmeasurable radiation 10), the TADF material exhibits a shifted emissionpattern 34, wherein the pattern shift depends from the direction of themeasurable radiation 10.

This is further illustrated in FIG. 5b , which shows that measurableradiation 10 “deforms” the homogenous emission pattern 32/36 to theshifted emission pattern 34/38. This deformation can be used todetermine the direction of incoming measurable radiation 10.

As shown in FIG. 5a , without measurable radiation 10, thermallyactivated delayed fluorescence from the TADF material results in auniform distribution 36 of photon emission. As illustrated in FIG. 5b ,measurable radiation 10 shifts and deforms the emission pattern suchthat a shifted and deformed distribution 38 of photon emission results.For example, in the illustration of FIG. 5b the distances d1 and d2between corresponding areas of the uniform distribution 36 and theshifted and deformed distribution 38 indicate that the direction alongwhich the underlying measurable radiation 10 comes from.

As known, in response to excitation radiation, generally TADF materialexhibits two effects, namely TAFD emission and phosphorescence emission.While phosphorescence emission results from an inter system crossing(ISC) transition, i.e. a transition from the S1 state to the T1 state,TADF emission results from a reverser ISC transition, i.e. a transitionfrom the T1 state to the S1 state.

However, experiments have demonstrated that phosphorescence emissiondoes not show a reaction to chi energy and measurable radiation,respectively; at least the reaction has not impact on the radiationdetection based on TAFD emission.

Particularly, chi energy/measurable radiation does not affectphosphorescence emission of TADF material such that a shifted emissionpattern as shown in FIGS. 4, 5 a and 5 b results.

Rather, the phosphorescence emission pattern remains essentially thesame. Therefore, phosphorescence emission impinging on the radiationdetection device 16 can be considered as essentially constant backgroundlight.

Data outputted by the radiation detection device 16 in response toreceived phosphorescence emission can be compared with background noiseand treated in the same way. For example, overall data output from theradiation detection device 16 may be filtered to remove phosphorescenceemission related data in order to obtain an effective radiationdetection device output, detection data being indicative of TADFemission.

In general, TADF material is temperature sensitive and, as a result, hastemperature dependent TADF emission. Therefore, a thermal calibrationmethod may be used to compensate temperature related effect.

For example, the whole detection arrangement 2 may be set up in athermally controlled thermal chamber, in which the temperature iscontrolled to change from a low/minimum level to a high/maximum level,preferably with constant speed. The temperature may be changed so slowthat, inside the thermal chamber, a quasi thermal equilibrium isachieved. For example, the temperature change may be such that the timeconstant of the thermal calibration method time constants of the thermalcalibration method are smaller than dynamics of the thermal chamber ofthe thermal calibration setting. For example, in some cases the timeconstant of the thermal calibration method can be in the range of abouttwo seconds and measuring time constant of the thermal calibrationsetting can be in the range of about two minutes. As further example,the thermal dynamics of the thermal calibration setting can be a thermalchange in the range of about 20° C. in about one hour.

The above temperature change process may carried out once or may berepeated for two or more different temperature change profiles (e.g.different constant speeds, stepwise including using different stepsizes). Experiments have shown that one or more temperature changeprocesses lasting about five to seven hours provide a good basis forthermal calibration.

During thermal calibration, the detection arrangement 2 may be operatednormally, for example, so that the TADF material is excited byexcitation radiation and TADF emission is detected by the radiationdetector device 16.

During the temperature change process(es), temperature and changesthereof of at least one of the detection layer 12, the TADF material,the excitation radiation source device 14 (and/or components thereof),the radiation detection device 16, the detection surface (e.g. detectionsurface 20 or 22), the detection layer's surface, the optical system 30,the housing 6 and electrical and/or electronic components (e.g. cables,amplifiers, signal conditioners, ADCs etc.) in the housing and/or in thethermal chamber are measured. This may be accomplished by one or moretemperature sensors respectively arranged in/on the housing and/or thethermal chamber.

The thusly measured temperatures and changes thereof (e.g. in form ofrespective time series) and, particularly, information on the TADFmaterial temperature and changes thereof, can be used to determineinformation (e.g. in form of regression curves) indicative of thetemperature dependency of the detection arrangement 2 and parts thereof,for example data output by the radiation detector device 16 and/or datareceived by the computing device 26.

Such information may be used to compensate temperature dependent effectsin radiation detection by the detection device 2.

In this context, it is noted that it can be assumed that generally thereis no correlation between, on the one hand, chi energy 4 reaching thedetection arrangement 2 and chi energy/measurable radiation reaching thedetection layer 12 and, on the other hand, temperature changes affectingthe detection arrangement 2. Nevertheless, it is preferred to not carryout calibration during unusual cosmic events, like full/new moon, solarflares and/or storms, Midheaven (Milky Way at MC point), for avoidingimpacts thereof onto calibration.

Reference numeral list 2 Detection arrangement 4 Chi energy 6 Housing 8Shieldable radiation 10 Measurable radiation 12 Detection layer 14Excitation radiation source device 16 Radiation detector device 18Excitation radiation 20 Planar detection surface 22 Curved detectionsurface 24 Detection layer's surface 26 Computing device 28 Thermallyactivated delayed fluorescence 30 Optical system 32 Homogenous emissionpattern 34 Shifted emission pattern 36 Uniform distribution pattern 38Shifted and deformed distribution pattern

1. Detection arrangement for detection of chi energy, the arrangementcomprising: a detection layer comprising thermally activated delayedfluorescence TADF material, the thermally activated delayed fluorescenceTADF material having an excitation frequency range and, exhibiting uponexcitation with radiation in the excitation frequency range, a thermallyactivated delayed fluorescence TADF emission, wherein the TADF materialhaving a TADF emission pattern without exposure to chi energy andexhibiting a different TADF emission pattern with exposure to chienergy.
 2. Detection arrangement according to claim 1, furthercomprising: a computing device, an excitation radiation source deviceadapted to emit excitation radiation in the excitation frequency range,a radiation detector device communicatively coupled with the computingdevice, the radiation detector device being adapted to detect TADFemission from the detection layer and provide respective detection datato the computing device. wherein the computing device is being adaptedto: compute detection data from the radiation detector device todetermine a TADF emission pattern without exposure to chi energy and adifferent TADF emission pattern with exposure to chi energy, compare thedetermined TADF emission patterns, determine, on the basis of thecomparison, exposure to chi energy onto the detection layer.
 3. Thedetection arrangement of claim 1, wherein the detection layer is atleast one of planar, provided in a coating material, shaped as a part ofa sphere, shaped as a hollow or solid sphere, shaped as a polyhedron. 4.The detection arrangement of claim 2, wherein the radiation detectordevice comprises at least one of a photo detector, a discrete radiationdetector, a radiation detector array including at least two detectorelements, electro-optical transducer, image intensifier tube, vacuumtube, CMOS chip a CCD chip.
 5. The detection arrangement of claim 1,comprising at least two radiation detector devices wherein the detectionlayer is arranged between the at least two radiation detector devices; acontrol device for controlling the operation of the excitation radiationsource device, wherein the control devices is adapted to operate theexcitation radiation source device in a constant emission mode and/or avariable/modifiable emission mode, comprising pulsed and/or periodicalemission mode, wherein, preferably, the computing device is able tocompute detection data from the radiation detector device during and/orfollowing radiation emission from the excitation radiation source deviceand/or an optical system being arranged between the detection layer andone or more of the radiation detector device.
 6. The detectionarrangement of claim 1, comprising a housing accommodating thecomponents of the detection arrangement.
 7. The detection arrangement ofclaim 1, wherein the housing has shielding properties for shielding ofat least one of: electro-magnetic radiation; X-ray radiation;ultraviolet radiation; Gamma radiation; corpuscular radiation,comprising alpha radiation, beta radiation, neutrons and/or protons. 8.The detection arrangement of claim 1, comprising at least onetemperature sensing device for sensing temperature of at least one ofthe detection layer, the TADF material, the excitation radiation sourcedevice, the radiation detector device, the housing, the optical system,the computing device, and/or wherein the detection arrangement or atleast one part thereof is arranged in a temperature controlledenvironment.
 9. Method of detecting chi energy using a detectionarrangement, comprising: providing a detection layer comprisingthermally activated delayed fluorescence TADF material, the thermallyactivated delayed fluorescence TADF material having an excitationfrequency range and, exhibiting upon excitation with radiation in theexcitation frequency range, a thermally activated delayed fluorescenceTADF emission, detecting TADF emission from the detection layer by meansof a radiation detector device, wherein the TADF material having a TADFemission pattern without exposure to chi energy and exhibiting adifferent TADF emission pattern with exposure to chi energy.
 10. Methodof detecting chi energy according to claim 9, further comprising thesteps of emitting excitation radiation in the excitation frequency rangeby means of an excitation radiation source device onto the detectionlayer in order to excite the TADF material, wherein the radiationdetector device is communicatively coupled to a computing device for thedetection of TADF emission from the detection layer; providing detectiondata from the radiation detector device to the computing device,computing the detection data from the radiation detector device todetermine a TADF emission pattern without exposure to chi energy and adifferent TADF emission pattern with exposure to chi energy, comparingthe determined TADF emission patterns, determining, on the basis of thecomparison, exposure to chi energy onto the detection layer.
 11. Methodof detecting chi energy according to claim 9, further comprising:controlling the operation of the excitation radiation source device bymeans of a control device and emitting radiation, by operating theexcitation radiation source device, in a constant emission mode and/or avariable/modifiable emission mode, comprising pulsed and/or periodicalemission mode; and/or arranging an optical system between the detectionlayer and the radiation detector device for adjusting the TADF emissiononto the radiation detector device; and/or at least one of: thermallycalibrating the radiation detection arrangement for compensation oftemperature related effects on the radiation detection device,arrangement calibrating the radiation detection device as such forcompensation of at least background radiation to which the radiationdetection device is exposed.
 12. Method of detecting chi energyaccording to claim 10, wherein, in an excitation phase, phase excitationradiation is emitted onto the detection layer in order to excite theTADF material and, in a detection phase subsequent to the excitationphase, TADF emission from the detection layer is detected, wherein theexcitation phase and the detection phase may overlap or there may be atransition phase between the excitation phase and the detection phase,during which transition phase neither excitation nor detection takesplace.
 13. Method of detecting chi energy according to claim 9, furthercomprising: providing a housing, having shielding properties to shieldat least one of: electro-magnetic radiation, X-ray radiation,Ultraviolet radiation, Gamma radiation, Corpuscular radiation, alpharadiation, beta radiation, neutrons protons.
 14. Use of a detectionarrangement according to claim 1 for the detection of chi energy.